4th International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing ; proceedings

presented at Adhesives in Electronics 2000, Espoo, Finland, June 18-21, 2000

by International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing (4th 2000 Espoo, Finland)

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Published 2000 by IEEE in Piscataway, New Jersey .
Written in English

Subjects:

• Electronic packaging -- Congresses.,
• Electronic packaging -- Materials -- Congresses.,
• Adhesive joints -- Congresses.,
• Coating processes -- Congresses.,
• Multichip modules (Microelectronics) -- Design and construction -- Congresses.

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Edition Notes

Other titles	Adhesive Joining and Coating Technology in Electronics Manufacturing 2000, Fourth International Conference on Adhesive Joining & Coating Technology in Electronics Manufacturing, Adhesives in Electronics 2000
Statement	conference chair Jorma Kivilahti ; proceedings editor, Marika Hyytiäien ; sponsored by NOKIA ... [et al.].
Genre	Congresses.
Contributions	Kivilahti, Jorma., Hyytiäinen, Marika., Nokia (Firm), Adhesives 2000 (2000 : Espoo, Finland)
Classifications
LC Classifications	TK7870.15 .I568 2000
The Physical Object
Pagination	xii, 319 p. :
Number of Pages	319
ID Numbers
Open Library	OL22414111M
ISBN 10	0780364600
LC Control Number	00003801

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